Extreme thinning of Si wafers for via-last and multi wafer stacking applications

Jourdain, AnneAnneJourdainDe Vos, JoeriJoeriDe VosRassoul, NouredineNouredineRassoulZahedmanesh, HoumanHoumanZahedmaneshMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneWalsby, EdwardEdwardWalsbyPatel, JashJashPatelAnsell, OliverOliverAnsellAshraf, HumaHumaAshrafThomas, DaveDaveThomasLi, ShifangShifangLiChang, TimothyTimothyChangHiebert, StephenStephenHiebertCross, AndrewAndrewCrossStoerring, MoritzMoritzStoerring2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30981Extreme thinning of Si wafers for via-last and multi wafer stacking applicationsProceedings paperhttps://ieeexplore.ieee.org/abstract/document/8429745/