"Terminal effect" on Cu electrochemical deposition: options and roadmap

Armini, SilviaSilviaArminiTokei, ZsoltZsoltTokeiVolders, HennyHennyVoldersEl-Mekki, ZaidZaidEl-MekkiRadisic, AlexAlexRadisicBeyer, GeraldGeraldBeyerRuythooren, WouterWouterRuythoorenVereecken, PhilippePhilippeVereecken2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/16666"Terminal effect" on Cu electrochemical deposition: options and roadmapOral presentation