Interface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of electrochemically deposited copper

Siau, S.S.SiauVervaet, A.A.VervaetSchacht, E.E.SchachtVan Calster, AndreAndreVan Calster2021-10-162021-10-162005-05https://imec-publications.be/handle/20.500.12860/11198Interface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of electrochemically deposited copperMeeting abstract