Cu1-xAlx films as alternatives to copper for advanced interconnect metallization

Soulie, Jean-PhilippeJean-PhilippeSoulieSankaran, KiroubanandKiroubanandSankaranPourtois, GeoffreyGeoffreyPourtoisSwerts, JohanJohanSwertsTokei, ZsoltZsoltTokeiAdelmann, ChristophChristophAdelmann2024-06-212024-06-2120241071-1023https://imec-publications.be/handle/20.500.12860/44069Cu1-xAlx films as alternatives to copper for advanced interconnect metallizationJournal article10.1116/6.0003634WOS:001250079000002