Jourdain, AnneAnneJourdainZiad, HocineHocineZiadDe Moor, PietPietDe MoorTilmans, HarrieHarrieTilmans2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/7712Wafer-scale 0-level packaging of (RF-)MEMS devices using BCBProceedings paper