Degryse, DominiekDominiekDegryseVandevelde, BartBartVandeveldeBeyne, EricEricBeyneChristiaens, FilipFilipChristiaensRoose, ErikErikRooseCorlatan, D.D.Corlatan2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5232Simulation of solder joint reliability for CBGA packagesProceedings paper