Spin-on dielectric liner TSV for 3D wafer level packaging applications

Civale, YannYannCivaleMajeed, BivraghBivraghMajeedSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanSoussan, PhilippePhilippeSoussanBeyne, EricEricBeyne2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/16876Spin-on dielectric liner TSV for 3D wafer level packaging applicationsProceedings paper