Jourdain, AnneAnneJourdainPhommahaxay, AlainAlainPhommahaxayVelenis, DimitriosDimitriosVelenisGuerrero, AliceAliceGuerreroBai, DongshunDongshunBaiYess, KimKimYessArnold, KimKimArnoldMiller, AndyAndyMillerRebibis, Kenneth JuneKenneth JuneRebibisBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25443Single-release-layer process for temporary bonding applications in 3D integration areaProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159699