Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)

Salahouelhadj, AbdellahAbdellahSalahouelhadjGonzalez, MarioMarioGonzalezPodpod, ArnitaArnitaPodpodBeyne, EricEricBeyne2023-02-202022-09-172023-02-2020220569-5503WOS:000848765300261https://imec-publications.be/handle/20.500.12860/40442Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)Proceedings paper10.1109/ECTC51906.2022.00268978-1-6654-7943-1WOS:000848765300261MASS DIFFUSIONEPOXYABSORPTIONSORPTIONMODEL