Impact of packaging stress on thinned 6T SRAM die

Hiblot, GaspardGaspardHiblotLiu, YefanYefanLiuVan der Plas, GeertGeertVan der Plas2021-10-282021-10-2820202168-1724https://imec-publications.be/handle/20.500.12860/35273Impact of packaging stress on thinned 6T SRAM dieJournal articlehttps://doi.org/10.1080/21681724.2018.1545924