Enabling porous low-k dielectric sealing in 22nm half-pitch (dual)damascene interconnects by deposition of sub-1nm thin organic films: from fundamentals to reliability

Armini, SilviaSilviaArmini2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/27763Enabling porous low-k dielectric sealing in 22nm half-pitch (dual)damascene interconnects by deposition of sub-1nm thin organic films: from fundamentals to reliabilityOral presentation