Directional Etching of Barrierless NiAl Lines on 300-mm Wafers for Interconnects Applications

Kundu, SouvikSouvikKunduSoulie, Jean-PhilippeJean-PhilippeSoulieMarti, GiulioGiulioMartiUlu Okudur, FulyaFulyaUlu OkudurKundu, ShreyaShreyaKunduSouriau, LaurentLaurentSouriauLazzarino, FredericFredericLazzarinoMurdoch, GayleGayleMurdochPark, SeonghoSeonghoParkTokei, ZsoltZsoltTokei2025-07-312024-11-302025-07-3120240741-3106WOS:001327759300017https://imec-publications.be/handle/20.500.12860/44876Directional Etching of Barrierless NiAl Lines on 300-mm Wafers for Interconnects ApplicationsJournal article10.1109/LED.2024.3449219WOS:001327759300017