Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill

Wang, TengTengWangDe Messemaeker, JokeJokeDe MessemaekerCherman, VladimirVladimirChermanKay, Alvin Chow CheeAlvin Chow CheeKayCadacio Jr., FranciscoFranciscoCadacio Jr.Matterne, MireilleMireilleMatterneSimons, VeerleVeerleSimonsVan De Peer, MyriamMyriamVan De PeerLesniewska, AlicjaAlicjaLesniewskaVarela Pedreira, OlallaOlallaVarela PedreiraGerets, CarineCarineGeretsRebibis, Kenneth JuneKenneth JuneRebibisBeyne, EricEricBeyne2021-10-232021-10-232015https://imec-publications.be/handle/20.500.12860/26160Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill – process and reliabilityProceedings paper