Philipsen, HaroldHaroldPhilipsenLuhn, OleOleLuhnCivale, YannYannCivaleSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanRuythooren, WouterWouterRuythooren2021-10-182021-10-182009https://imec-publications.be/handle/20.500.12860/16016Through-silicon via technology for 3D applicationsMeeting abstract