Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Kljucar, LukaLukaKljucarGonzalez, MarioMarioGonzalezCroes, KristofKristofCroesDe Wolf, IngridIngridDe WolfDe Messemaeker, JokeJokeDe MessemaekerMurdoch, GayleGayleMurdochNolmans, PhilipPhilipNolmansDe Vos, JoeriJoeriDe VosBoemmels, JuergenJuergenBoemmelsTokei, ZsoltZsoltTokei2021-10-242021-10-2420170026-2714https://imec-publications.be/handle/20.500.12860/28691Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnectsJournal articlehttp://www.sciencedirect.com/science/article/pii/S0026271417303013