Cauwe, MaartenMaartenCauweVandevelde, BartBartVandeveldeNawghane, ChinmayChinmayNawghaneVan De Slyeke, MarnixMarnixVan De SlyekeBosman, ErwinErwinBosmanVerhegge, JoachimJoachimVerheggeCoulon, AlexiaAlexiaCoulonHeltzel, StanStanHeltzel2021-10-282021-10-2820201551-4897https://imec-publications.be/handle/20.500.12860/34870High-density interconnect technology assessment of printed circuit boards for space applicationsJournal articlehttps://doi.org/10.4071/imaps.1212898