Variation in process conditions of porogen-based low-k films: A method to improve performance without changing existing process steps in a sub-100 nm Cu damascene integration route

De Roest, DavidDavidDe RoestTravaly, YoussefYoussefTravalyBeynet, J.J.BeynetSprey, HesselHesselSpreyLabat, J.J.LabatHuffman, CraigCraigHuffmanVerdonck, PatrickPatrickVerdonckKaneko, SSKanekoMatsushita, KKMatsushitaKobayashi, NNKobayashiBeyer, GeraldGeraldBeyer2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/16963Variation in process conditions of porogen-based low-k films: A method to improve performance without changing existing process steps in a sub-100 nm Cu damascene integration routeJournal article10.1016/j.mee.2009.06.036