Modelling stress evolution and voiding in copper nano-interconnect under thermal gradients

Zahedmanesh, HoumanHoumanZahedmaneshCroes, KristofKristofCroes2021-10-292021-10-2920200026-2714https://imec-publications.be/handle/20.500.12860/36389Modelling stress evolution and voiding in copper nano-interconnect under thermal gradientsJournal article10.1016/j.microrel.2020.113769