Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6 +N2 +H2

Li, HuaHuaLiHeyvaert, IlseIlseHeyvaertSing, JinJinSingLanckmans, FilipFilipLanckmansBrijs, BertBertBrijsBender, HugoHugoBenderMaex, KarenKarenMaexFroyen, L.L.Froyen2021-10-142021-10-141999https://imec-publications.be/handle/20.500.12860/3620Characterization and barrier properties for Cu metallization of tungsten nitride deposited by PECVD using WF6 +N2 +H2Proceedings paper