GHz-Scanning Acoustic Microscopy combined with TOFSIMS/AFM for wafer-level failure analysis of bonding interfaces

De Wolf, IngridIngridDe WolfKhaled, AhmadAhmadKhaledFranquet, AlexisAlexisFranquetSpampinato, ValentinaValentinaSpampinatoConard, ThierryThierryConardBrand, SebastianSebastianBrandKögel, MichaelMichaelKögelWiesler, IngoIngoWiesler2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/32846GHz-Scanning Acoustic Microscopy combined with TOFSIMS/AFM for wafer-level failure analysis of bonding interfacesProceedings paper