Fast convolution based thermal model for 3D-ICs: methodology, accuracy analysis and package impact

Maggioni, FedericaFedericaMaggioniOprins, HermanHermanOprinsBeyne, EricEricBeyneDe Wolf, IngridIngridDe WolfBaelmans, MartineMartineBaelmans2021-10-222021-10-222014-120026-2692https://imec-publications.be/handle/20.500.12860/24177Fast convolution based thermal model for 3D-ICs: methodology, accuracy analysis and package impactJournal articlehttp://dx.doi.org/10.1016/j.mejo.2014.04.044