Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

Govaerts, JonathanJonathanGovaertsBosman, ErwinErwinBosmanChristiaens, WimWimChristiaensVanfleteren, JanJanVanfleteren2021-10-182021-10-1820101521-3323https://imec-publications.be/handle/20.500.12860/17179Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technologyJournal article