De Moor, PietPietDe MoorDe Munck, KoenKoenDe MunckSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanSwinnen, BartBartSwinnenVan Hoof, ChrisChrisVan Hoof2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/11962Wafer level high density 3D integration technologies for space applicationsOral presentation