In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures

Vanstreels, KrisKrisVanstreelsCzarnecki, PiotrPiotrCzarneckiKirimura, TomoyukiTomoyukiKirimuraSiew, Yong KongYong KongSiewTokei, ZsoltZsoltTokeiBoemmels, JuergenJuergenBoemmelsCroes, KristofKristofCroes2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/23306In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structuresMeeting abstract