Integration of electroless and electrolytic Cu in the IC back end line of technologies

Maex, KarenKarenMaexPalmans, RogerRogerPalmansLantasov, YuriYuriLantasovBrongersma, SywertSywertBrongersmaRichard, EmmanuelEmmanuelRichardVervoort, IwanIwanVervoort2021-10-142021-10-141999https://imec-publications.be/handle/20.500.12860/3646Integration of electroless and electrolytic Cu in the IC back end line of technologiesMeeting abstract