El-Mekki, ZaidZaidEl-MekkiRadisic, AlexAlexRadisicPhilipsen, HaroldHaroldPhilipsenHonore, MiaMiaHonoreSlabbekoorn, JohnJohnSlabbekoornStruyf, HerbertHerbertStruyfArnold, MarcoMarcoArnoldFluegel, AlexanderAlexanderFluegelMayer, DieterDieterMayerShu-Ya Chang, IrisIrisShu-Ya Chang2021-10-242021-10-2420171526-1344https://imec-publications.be/handle/20.500.12860/28304Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applicationsJournal articlehttp://www.chipscalereview.com/issue/1702/ChipScale_Jan_Feb_2017.pdf