Technology benchmarking of copper electromigration using a grain-sensitive simulation framework

Saleh, AhmedAhmedSalehCroes, KristofKristofCroesCeric, H.H.CericDe Wolf, IngridIngridDe WolfZahedmanesh, HoumanHoumanZahedmanesh2025-03-062025-03-062024979-8-3503-8518-22380-632XWOS:001411360600039https://imec-publications.be/handle/20.500.12860/45318Technology benchmarking of copper electromigration using a grain-sensitive simulation frameworkProceedings paper10.1109/IITC61274.2024.10732543979-8-3503-8517-5WOS:001411360600039