3D stacked IC demonstration using a through silicon via first approach

Van Olmen, JanJanVan OlmenMercha, AbdelkarimAbdelkarimMerchaKatti, GuruprasadGuruprasadKattiHuyghebaert, CedricCedricHuyghebaertVan Aelst, JokeJokeVan AelstSeppala, EmmaEmmaSeppalaZhao, ChaoChaoZhaoArmini, SilviaSilviaArminiVaes, JanJanVaesCotrin Teixeira, RicardoRicardoCotrin TeixeiraVan Cauwenberghe, MarcMarcVan CauwenbergheVerdonck, PatrickPatrickVerdonckVerhemeldonck, KoenKoenVerhemeldonckJourdain, AnneAnneJourdainRuythooren, WouterWouterRuythoorende Potter de ten Broeck, MurielMurielde Potter de ten BroeckOpdebeeck, AnnAnnOpdebeeckChiarella, ThomasThomasChiarellaParvais, BertrandBertrandParvaisDebusschere, IngridIngridDebusschereHoffmann, Thomas Y.Thomas Y.HoffmannDe Wachter, BartBartDe WachterDehaene, WimWimDehaeneStucchi, MicheleMicheleStucchiRakowski, MichalMichalRakowskiSoussan, PhilippePhilippeSoussanCartuyvels, RudiRudiCartuyvelsBeyne, EricEricBeyneBiesemans, SergeSergeBiesemansSwinnen, BartBartSwinnen2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/146743D stacked IC demonstration using a through silicon via first approachProceedings paper