Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications

Kusters, RoelRoelKustersSridhar, AshokAshokSridharCauwe, MaartenMaartenCauwevan den Brand, JeroenJeroenvan den Brand2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24083Flip-chip bonding of fine-pitch ultra-thin chips for SiF applicationsProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6962786