Time and temperature dependence of early stages of stress-induced-voiding in Cu/low-k interconnects

Croes, KristofKristofCroesWilson, ChrisChrisWilsonLofrano, MelinaMelinaLofranoTravaly, YoussefYoussefTravalyDe Roest, DavidDavidDe RoestTokei, ZsoltZsoltTokeiBeyer, GeraldGeraldBeyer2021-10-172021-10-172009https://imec-publications.be/handle/20.500.12860/15139Time and temperature dependence of early stages of stress-induced-voiding in Cu/low-k interconnectsProceedings paper