Cavaco, CelsoCelsoCavacoPeng, LanLanPengDe Leersnijder, KoenKoenDe LeersnijderGuerrieri, StefanoStefanoGuerrieriSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanOsman, HarisHarisOsman2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25036Copper oxide direct bonding of 200mm CMOS wafers: morphological and electrical characterizationProceedings paper