Probabilistic design approach for package design and solder joint reliability optimization for a lead free BGA package

Limaye, PareshPareshLimayeVandevelde, BartBartVandeveldeVan de Peer, JoostJoostVan de PeerDonders, S.S.DondersDarveaux, RobertRobertDarveaux2021-10-162021-10-162005-04https://imec-publications.be/handle/20.500.12860/10785Probabilistic design approach for package design and solder joint reliability optimization for a lead free BGA packageProceedings paper