Inoue, FumihiroFumihiroInoueJourdain, AnneAnneJourdainVisker, JakobJakobViskerPeng, LanLanPengMoeller, BertholdBertholdMoellerYokoyama, YokoyamaYokoyamaYokoyamaPhommahaxay, AlainAlainPhommahaxayRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyne, EricEricBeyneSleeckx, ErikErikSleeckx2021-10-242021-10-2420170167-9317https://imec-publications.be/handle/20.500.12860/28565Edge trimming for surface activated dielectric bonded wafersJournal articlehttp://www.sciencedirect.com/science/article/pii/S0167931716304488