Surface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applications

De Preter, IngeIngeDe PreterDerakhshandeh, JaberJaberDerakhshandehHeylen, NancyNancyHeylenRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25146Surface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applicationsMeeting abstract