Kim, Soon-WookSoon-WookKimFodor, FerencFerencFodorHeylen, NancyNancyHeylenIacovo, SerenaSerenaIacovoDe Vos, JoeriJoeriDe VosMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2022-01-192021-11-022022-01-1920200569-5503WOS:000620983200034https://imec-publications.be/handle/20.500.12860/38146Novel Cu/SiCN surface topography control for 1 mu m pitch hybrid wafer-to-wafer bondingProceedings paper10.1109/ECTC32862.2020.00046978-1-7281-6180-8WOS:000620983200034