Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packaging

Buisson, ThibaultThibaultBuissonPotoms, GoedeleGoedelePotomsPhommahaxay, AlainAlainPhommahaxayVerbinnen, GreetGreetVerbinnenJaenen, PatrickPatrickJaenenLa Manna, AntonioAntonioLa MannaTravaly, YoussefYoussefTravalyBeyne, EricEricBeyne2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/18630Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packagingProceedings paper