Electromigration behavior of 2μm sub-micron Cu/SiCN hybrid bonds

De Messemaeker, JokeJokeDe MessemaekerKim, Soon-WookSoon-WookKimStucchi, MicheleMicheleStucchiBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneCroes, KristofKristofCroes2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/32811Electromigration behavior of 2μm sub-micron Cu/SiCN hybrid bondsProceedings paperhttps://iitc-conference.org/2019-iitc-mam-program/