On the feasibility of die-to-wafer inorganic dielectric bonding

Wang, TengTengWangPodpod, ArnitaArnitaPodpodCapuz, GiovanniGiovanniCapuzPeng, LanLanPengPhommahaxay, AlainAlainPhommahaxayInoue, FumihiroFumihiroInoueBex, PieterPieterBexDubey, VikasVikasDubeyRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27576On the feasibility of die-to-wafer inorganic dielectric bondingProceedings paperhttp://ieeexplore.ieee.org/document/7764694