Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide

Wang, LiangLiangWangSterken, TomTomSterkenCauwe, MaartenMaartenCauweCuypers, DieterDieterCuypersVanfleteren, JanJanVanfleteren2021-10-202021-10-2020122156-3950https://imec-publications.be/handle/20.500.12860/21830Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimideJournal article