Integration of the 3MS low-k CVD material in a 0.18µm Cu single damascene process

Gao, TengTengGaoGray, WilliamWilliamGrayVan Hove, MarleenMarleenVan HoveStruyf, HerbertHerbertStruyfMeynen, HermanHermanMeynenVanhaelemeersch, SergeSergeVanhaelemeersch2021-10-062021-10-061999https://imec-publications.be/handle/20.500.12860/3460Integration of the 3MS low-k CVD material in a 0.18µm Cu single damascene processOral presentation