Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration

Zhang, WenqiWenqiZhangLimaye, PareshPareshLimayeCivale, YannYannCivaleLabie, RietRietLabieSoussan, PhilippePhilippeSoussan2021-10-192021-10-192010https://imec-publications.be/handle/20.500.12860/18419Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integrationProceedings paper