Lin, Shih-HsiangShih-HsiangLinSimicic, MarkoMarkoSimicicPantano, NicolasNicolasPantanoChen, Shih-HungShih-HungChenRoussel, PhilippePhilippeRousselVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyneWambacq, PietPietWambacq2024-03-212023-11-302024-03-2120230739-5159WOS:001094864400018https://imec-publications.be/handle/20.500.12860/43201ESD mitigation for 3D IC hybrid bondingProceedings paper978-1-58537-347-5WOS:001094864400018