Revealing the Origins of Thermally Induced Anomaly in 18 nm Pitch Ruthenium Nanointerconnects on 300 mm Wafers

Shah, Asif A.Asif A.ShahDelie, GillesGillesDelieKhomyakov, Petr A.Petr A.KhomyakovWellendorff, JessJessWellendorffRichard, OlivierOlivierRichardPark, SeonghoSeonghoParkShrivastava, MayankMayankShrivastavaCeric, HajdinHajdinCericZahedmanesh, HoumanHoumanZahedmanesh2026-07-272026-07-2720261944-82441944-8252https://imec-publications.be/handle/20.500.12860/59995engRevealing the Origins of Thermally Induced Anomaly in 18 nm Pitch Ruthenium Nanointerconnects on 300 mm WafersJournal article10.1021/acsami.6c03315WOS:001730281300001FUTURE COPPER INTERCONNECTSSELF-DIFFUSIONOXYGENTECHNOLOGYRESISTANCEINSIGHTSRU(0001)METALSCOCUMEDLINE:419144721944-8252