Vandevelde, BartBartVandeveldeLabie, RietRietLabieCherman, VladimirVladimirChermanWebers, TomasTomasWebersWinters, ChristopheChristopheWintersBeyne, EricEricBeyneDosseul, FranckFranckDosseul2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/20020Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assembliesProceedings paper