Dicing Lane Quality Quantification & Wafer Assessment Using Image Thresholding Techniques

Leech, DamienDamienLeechHiro, AkitoAkitoHiroSchoofs, GeertGeertSchoofsTunca Altintas, BensuBensuTunca AltintasPhommahaxay, AlainAlainPhommahaxayKennes, KoenKoenKennesBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2025-04-162025-02-152025-04-162024979-8-3503-9037-72687-9700WOS:001340802800072https://imec-publications.be/handle/20.500.12860/45220Dicing Lane Quality Quantification & Wafer Assessment Using Image Thresholding TechniquesProceedings paper10.1109/ESTC60143.2024.10712068979-8-3503-9036-0WOS:001340802800072TECHNOLOGIES