Characterization of inorganic dielectric layers for low thermal budget wafer to wafer bonding

Inoue, FumihiroFumihiroInouePeng, LanLanPengPhommahaxay, AlainAlainPhommahaxayKim, Soon-WookSoon-WookKimDe Vos, JoeriJoeriDe VosSleeckx, ErikErikSleeckxMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/28566Characterization of inorganic dielectric layers for low thermal budget wafer to wafer bondingProceedings paper