Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies

van der Veen, MarleenMarleenvan der VeenVandersmissen, KevinKevinVandersmissenDictus, DriesDriesDictusDemuynck, StevenStevenDemuynckLiu, RanRanLiuBin, XiaominXiaominBinNalla, PraveenPraveenNallaLesniewska, AlicjaAlicjaLesniewskaHall, LaurieLaurieHallCroes, KristofKristofCroesZhao, LarryLarryZhaoBoemmels, JuergenJuergenBoemmelsKolics, ArturArturKolicsTokei, ZsoltZsoltTokei2021-10-232021-10-232015https://imec-publications.be/handle/20.500.12860/26051Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologiesProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325605