Vandevelde, BartBartVandeveldeVandecasteele, BjornBjornVandecasteeleVanderstraeten, DanielDanielVanderstraetenBrizar, GuyGuyBrizarBlansaer, EddyEddyBlansaer2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14712Flip chip based packaging solution for high current driver chips used in automotive applicationsProceedings paper