Kim, Soon-WookSoon-WookKimPeng, LanLanPengMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneLee, Chung SunChung SunLee2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25477Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectricsProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7334576