Jourdain, AnneAnneJourdainStoukatch, SergueiSergueiStoukatchDe Moor, PietPietDe MoorRuythooren, WouterWouterRuythoorenPargfrieder, S.S.PargfriederSwinnen, BartBartSwinnenBeyne, EricEricBeyne2021-10-162021-10-162007-06https://imec-publications.be/handle/20.500.12860/12373Simultaneous Cu-Cu and compliant dielectric bonding for 3D stacking of ICsProceedings paper